Invention Grant
- Patent Title: Multilayered ceramic capacitor and mounting board therefor
- Patent Title (中): 多层陶瓷电容器及其安装板
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Application No.: US13949672Application Date: 2013-07-24
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Publication No.: US09123474B2Publication Date: 2015-09-01
- Inventor: Min Cheol Park , Heung Kil Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0044157 20130422
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/38 ; H05K1/18 ; H01G4/30 ; H01G4/232

Abstract:
There is provided a multilayer ceramic capacitor including a ceramic body, first to third capacitor parts, first and second internal connection conductors, and first to fourth external electrodes, wherein the first capacitor part is connected in series with the second internal connection conductor, and the second capacitor part is connected in series with the first internal connection conductor.
Public/Granted literature
- US20140311784A1 MULTILAYERED CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR Public/Granted day:2014-10-23
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