Invention Grant
US09123528B2 Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips
有权
复合基板，具有复合基板的半导体芯片以及复合基板和半导体芯片的制造方法
- Patent Title: Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips
- Patent Title (中): 复合基板，具有复合基板的半导体芯片以及复合基板和半导体芯片的制造方法
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Application No.: US13883730Application Date: 2011-12-16
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Publication No.: US09123528B2Publication Date: 2015-09-01
- Inventor: Johannes Baur , Berthold Hahn , Karl Engl , Volker Haerle , Joachim Hertkorn , Tetsuya Taki
- Applicant: Johannes Baur , Berthold Hahn , Karl Engl , Ann-Kathrin Haerle , Jakob Johannes Haerle , Johanna Magdalena Haerle , Joachim Hertkorn , Tetsuya Taki
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102010056447 20101228; DE102011012298 20110224
- International Application: PCT/EP2011/073134 WO 20111216
- International Announcement: WO2012/089540 WO 20120705
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L21/78 ; H01L21/02 ; H01L33/00 ; H01L33/08
Abstract:
A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.
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