Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13274877Application Date: 2011-10-17
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Publication No.: US09123543B1Publication Date: 2015-09-01
- Inventor: Jung Gi Jin , Jong Sik Paek , Sung Su Park , Seok Bong Kim , Tae Kyung Hwang , Se Woong Cha
- Applicant: Jung Gi Jin , Jong Sik Paek , Sung Su Park , Seok Bong Kim , Tae Kyung Hwang , Se Woong Cha
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/00
Abstract:
A semiconductor device and method of manufacturing the same are provided. The semiconductor device comprises a semiconductor die including a bond pad, a redistribution layer, and a solder ball. The redistribution layer is formed by sequentially plating copper and nickel, sequentially plating nickel and copper, or sequentially plating copper, nickel, and copper. The redistribution layer includes a nickel layer in order to prevent a crack from occurring in a copper layer. Further, a projection is formed in an area of the redistribution layer or a dielectric layer to which the solder ball is welded and corresponds, so that an area of the redistribution layer to which the solder ball is welded increases, thereby increasing bonding power between the solder ball and the redistribution layer.
Information query
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