Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14449028Application Date: 2014-07-31
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Publication No.: US09123548B1Publication Date: 2015-09-01
- Inventor: Jin-Gun Koo , Jong Il Won , Hyun-cheol Bae , Sang Gi Kim , Yil Suk Yang
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2014-0015010 20140210
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L21/8249

Abstract:
Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.
Public/Granted literature
- US20150228640A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-08-13
Information query
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