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US09123548B1 Semiconductor device and method of fabricating the same 有权
半导体装置及其制造方法

Semiconductor device and method of fabricating the same
Abstract:
Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.
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