Invention Grant
- Patent Title: Superjunction semiconductor device
- Patent Title (中): 超结半导体器件
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Application No.: US13657164Application Date: 2012-10-22
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Publication No.: US09123561B2Publication Date: 2015-09-01
- Inventor: Takahiro Tamura , Yasuhiko Onishi , Mutsumi Kitamura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2011-232189 20111021
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/78 ; H01L29/06 ; H01L29/40 ; H01L29/10

Abstract:
A superjunction semiconductor device is disclosed in which the trade-off relationship between breakdown voltage characteristics and voltage drop characteristics is considerably improved, and it is possible to greatly improve the charge resistance of an element peripheral portion and long-term breakdown voltage reliability. It includes parallel pn layers of n-type drift regions and p-type partition regions in superjunction structure. PN layers are depleted when off-state voltage is applied. Repeating pitch of the second parallel pn layer in a ring-like element peripheral portion encircling the element active portion is smaller than repeating pitch of the first parallel pn layer in the element active portion. Element peripheral portion includes low concentration n-type region on the surface of the second parallel pn layer. The depth of p-type partition region of an outer peripheral portion in the element peripheral portion is smaller than the depth of p-type partition region of an inner peripheral portion.
Public/Granted literature
- US20130099347A1 SUPERJUNCTION SEMICONDUCTOR DEVICE Public/Granted day:2013-04-25
Information query
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