Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13474568Application Date: 2012-05-17
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Publication No.: US09123576B2Publication Date: 2015-09-01
- Inventor: Seong Eun Lee
- Applicant: Seong Eun Lee
- Applicant Address: KR Icheon
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon
- Priority: KR10-2011-0141359 20111223
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/768

Abstract:
A semiconductor device and a method for manufacturing the same are disclosed, which can improve device characteristics by increasing a process margin between an active region and a storage node contact. The semiconductor device includes an active region, a device isolation film formed to have a lower height than the active region, and exposing an upper part of the active region, and a barrier pattern formed at a sidewall of the exposed active region of an upper part of the device isolation film.
Public/Granted literature
- US20130161781A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-06-27
Information query
IPC分类: