Invention Grant
US09123576B2 Semiconductor device and method for manufacturing the same 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method for manufacturing the same
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US13474568
    Application Date: 2012-05-17
  • Publication No.: US09123576B2
    Publication Date: 2015-09-01
  • Inventor: Seong Eun Lee
  • Applicant: Seong Eun Lee
  • Applicant Address: KR Icheon
  • Assignee: SK HYNIX INC.
  • Current Assignee: SK HYNIX INC.
  • Current Assignee Address: KR Icheon
  • Priority: KR10-2011-0141359 20111223
  • Main IPC: H01L27/108
  • IPC: H01L27/108 H01L21/768
Semiconductor device and method for manufacturing the same
Abstract:
A semiconductor device and a method for manufacturing the same are disclosed, which can improve device characteristics by increasing a process margin between an active region and a storage node contact. The semiconductor device includes an active region, a device isolation film formed to have a lower height than the active region, and exposing an upper part of the active region, and a barrier pattern formed at a sidewall of the exposed active region of an upper part of the device isolation film.
Public/Granted literature
Information query
Patent Agency Ranking
0/0