An apparatus for infrared imaging may include a hybrid infrared focal plane array including a front-end (FE) portion and a back-end (BE) portion. The FE portion may be coupled to the BE portion via multiple electrically conductive bump bonds. The FE portion may include nano-electronic circuits integrated with an array of infrared imaging pixels. The CNT electronic circuits may be configured to generate multiplexed output signals. The BE portion may include electronic circuits implemented on a substrate and configured to generate readout output signals. A count of the multiple electrically conductive bump bonds may be substantially less than a count of the infrared imaging pixels of the array.