Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method of solid-state imaging device and electronic apparatus
- Patent Title (中): 固态成像装置,固态成像装置和电子装置的制造方法
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Application No.: US13456440Application Date: 2012-04-26
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Publication No.: US09123609B2Publication Date: 2015-09-01
- Inventor: Keiki Fukuda
- Applicant: Keiki Fukuda
- Applicant Address: JP
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2011-104897 20110510
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146 ; G02B5/30 ; H04N5/217 ; H04N13/02

Abstract:
A solid-state imaging device includes: a photoelectric conversion device; a wire grid polarizer provided on the photoelectric conversion device; and a conductive film electrically connecting conductive layers provided in the photoelectric conversion device to the wire grid polarizer.
Public/Granted literature
- US20120287297A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2012-11-15
Information query
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