Invention Grant
US09123615B2 Vertically integrated image sensor chips and methods for forming the same
有权
垂直集成的图像传感器芯片及其形成方法
- Patent Title: Vertically integrated image sensor chips and methods for forming the same
- Patent Title (中): 垂直集成的图像传感器芯片及其形成方法
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Application No.: US14281271Application Date: 2014-05-19
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Publication No.: US09123615B2Publication Date: 2015-09-01
- Inventor: Jeng-Shyan Lin , Feng-Chi Hung , Dun-Nian Yaung , Jen-Cheng Liu , Szu-Ying Chen , Wen-De Wang , Tzu-Hsuan Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L27/146
Abstract:
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via.
Public/Granted literature
- US20140308772A1 Vertically Integrated Image Sensor Chips and Methods for Forming the Same Public/Granted day:2014-10-16
Information query
IPC分类:
