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US09123616B2 Dark current reduction for back side illuminated image sensor 有权
背面照明图像传感器的暗电流降低

Dark current reduction for back side illuminated image sensor
Abstract:
A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.
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