Invention Grant
- Patent Title: Integrated passive flip chip package
- Patent Title (中): 集成无源倒装芯片封装
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Application No.: US14192402Application Date: 2014-02-27
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Publication No.: US09123626B1Publication Date: 2015-09-01
- Inventor: You Chye How , Siew Kee Lee , Huay Yann Tay
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L21/00 ; H01L25/16 ; H01L23/495 ; H01L23/528 ; H01L23/00 ; H01L23/31 ; H01L23/532 ; H01L21/768 ; H01L21/56 ; H01L25/00
Abstract:
A method for packaging integrated circuit die such that each package includes die with integrated passive components mounted to either the back surface, the active surface or both the back and active surfaces of the die.
Public/Granted literature
- US20150243639A1 INTEGRATED PASSIVE FLIP CHIP PACKAGE Public/Granted day:2015-08-27
Information query
IPC分类:
