Invention Grant
- Patent Title: Method for molecular adhesion bonding with compensation for radial misalignment
- Patent Title (中): 分子粘合粘合方法，补偿径向不对中
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Application No.: US13838031Application Date: 2013-03-15
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Publication No.: US09123631B2Publication Date: 2015-09-01
- Inventor: Gweltaz Gaudin
- Applicant: SOITEC
- Applicant Address: FR Bernin
- Assignee: SOITEC
- Current Assignee: SOITEC
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1055508 20100707
- Main IPC: B29C65/00
- IPC: B29C65/00 ; H01L21/18 ; H01L23/00 ; H01L25/065 ; H01L25/00
Abstract:
A method for bonding a first wafer on a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
Public/Granted literature
- US20130210171A1 METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT Public/Granted day:2013-08-15
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