Invention Grant
- Patent Title: Multi-heterojunction nanoparticles, methods of manufacture thereof and articles comprising the same
- Patent Title (中): 多异质结纳米颗粒，其制备方法和包含其的制品
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Application No.: US13834381Application Date: 2013-03-15
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Publication No.: US09123638B2Publication Date: 2015-09-01
- Inventor: Moonsub Shim , Nuri Oh , You Zhai , Sooji Nam , Peter Trefonas , Kishori Deshpande , Jake Joo
- Applicant: Moonsub Shim , Nuri Oh , You Zhai , Sooji Nam , Peter Trefonas , Kishori Deshpande , Jake Joo
- Applicant Address: US MA Marlborough US IL Urbana US MI Midland
- Assignee: Rohm and Haas Electronic Materials, LLC,The University of Illinois, The Office of Technology Management,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials, LLC,The University of Illinois, The Office of Technology Management,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US IL Urbana US MI Midland
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/22 ; B82Y10/00 ; B82Y30/00 ; B82Y40/00 ; H01L31/0296 ; H01L31/0352 ; H01L29/12 ; H01L33/06 ; H01L51/50 ; B82Y20/00
Abstract:
Disclosed herein is a semiconducting nanoparticle comprising a one-dimensional semiconducting nanoparticle having a first end and a second end; where the second end is opposed to the first end; a first node that comprises a first semiconductor; where the first node contacts a radial surface of the one-dimensional semiconducting nanoparticle producing a first heterojunction at the point of contact; and a second node that comprises a second semiconductor; where the second node contacts the radial surface of the one-dimensional semiconducting nanoparticle producing a second heterojunction at the point of contact; where the first heterojunction is compositionally different from the second heterojunction.
Public/Granted literature
- US20140264259A1 MULTI-HETEROJUNCTION NANOPARTICLES, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME Public/Granted day:2014-09-18
Information query
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