Invention Grant
US09123650B2 Plasma confinement rings including RF absorbing material for reducing polymer deposition
有权
等离子体约束环包括用于减少聚合物沉积的RF吸收材料
- Patent Title: Plasma confinement rings including RF absorbing material for reducing polymer deposition
- Patent Title (中): 等离子体约束环包括用于减少聚合物沉积的RF吸收材料
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Application No.: US13706640Application Date: 2012-12-06
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Publication No.: US09123650B2Publication Date: 2015-09-01
- Inventor: James H. Rogers
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Agency: Buchanan, Ingersoll & Rooney PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/3065 ; H01J37/32
Abstract:
Plasma confinement rings are adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to substantially reduce polymer deposition on those surfaces. The plasma confinement rings include an RF lossy material effective to enhance heating at portions of the rings. A low-emissivity material can be provided on a portion of the plasma confinement ring assembly to enhance heating effects.
Public/Granted literature
- US20130095666A1 PLASMA CONFINEMENT RINGS INCLUDING RF ABSORBING MATERIAL FOR REDUCING POLYMER DEPOSITION Public/Granted day:2013-04-18
Information query
IPC分类:
