Invention Grant
- Patent Title: Chemical mechanical polishing slurry compositions and polishing method using the same
- Patent Title (中): 化学机械抛光浆料组合物和使用其的抛光方法
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Application No.: US13534647Application Date: 2012-06-27
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Publication No.: US09123660B2Publication Date: 2015-09-01
- Inventor: Tai Young Kim , Byoung Ho Choi , Chang Ki Hong , Hyung Soo Kim
- Applicant: Tai Young Kim , Byoung Ho Choi , Chang Ki Hong , Hyung Soo Kim
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2009-0136124 20091231; KR10-2010-0139758 20101231
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; H01L21/3105
Abstract:
Disclosed herein is a CMP slurry composition. The CMP slurry composition includes cerium oxide particles, an adsorbent for adsorbing the cerium oxide particles to a polishing pad, an adsorption adjusting agent for adjusting adsorption performance of the adsorbent, and a pH adjusting agent. The CMP slurry composition may improve polishing efficiency of a patterned oxide layer and lifespan of a diamond disc conditioner.
Public/Granted literature
- US20120282775A1 Chemical Mechanical Polishing Slurry Compositions and Polishing Method Using the Same Public/Granted day:2012-11-08
Information query
