Invention Grant
- Patent Title: Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
- Patent Title (中): 具有前端热接触的微电子封装及其制造方法
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Application No.: US13942518Application Date: 2013-07-15
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Publication No.: US09123685B2Publication Date: 2015-09-01
- Inventor: Weng Foong Yap , Douglas G. Mitchell
- Applicant: Weng Foong Yap , Douglas G. Mitchell
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR INC.
- Current Assignee: FREESCALE SEMICONDUCTOR INC.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/367 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/538
Abstract:
Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes forming one or more redistribution layers over an encapsulated die having a frontside bond pad area and a frontside passivated non-bond pad area. The redistribution layers are formed to have a frontside opening over the non-bond pad area of the encapsulated die. A primary heat sink body is provided in the frontside opening and thermally coupled to the encapsulated die. A contact array is formed over the redistribution layers and is electrically coupled to a plurality bond pads located on the frontside bond pad area of the encapsulated die.
Public/Granted literature
- US20150014838A1 MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METHODS FOR THE FABRICATION THEREOF Public/Granted day:2015-01-15
Information query
IPC分类:
