Invention Grant
- Patent Title: Thermal management for solid-state drive
- Patent Title (中): 固态驱动器的热管理
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Application No.: US13904992Application Date: 2013-05-29
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Publication No.: US09123686B2Publication Date: 2015-09-01
- Inventor: Richard A. Mataya , Tegan Campbell
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/373 ; B82Y10/00 ; H01L23/367 ; H01L23/42 ; H01L23/498
Abstract:
An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal conduction plane. A frame is connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component. The electronic device further includes at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.
Public/Granted literature
- US20140306335A1 THERMAL MANAGEMENT FOR SOLID-STATE DRIVE Public/Granted day:2014-10-16
Information query
IPC分类:
