Invention Grant
US09123689B2 Epoxy resin composition, method for producing same, and semiconductor device using same
有权
环氧树脂组合物及其制造方法以及使用该树脂组合物的半导体装置
- Patent Title: Epoxy resin composition, method for producing same, and semiconductor device using same
- Patent Title (中): 环氧树脂组合物及其制造方法以及使用该树脂组合物的半导体装置
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Application No.: US14004841Application Date: 2012-03-15
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Publication No.: US09123689B2Publication Date: 2015-09-01
- Inventor: Sayaka Takeda , Masao Tomikawa
- Applicant: Sayaka Takeda , Masao Tomikawa
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-057711 20110316
- International Application: PCT/JP2012/056762 WO 20120315
- International Announcement: WO2012/124780 WO 20120920
- Main IPC: C08K5/07
- IPC: C08K5/07 ; C08L63/00 ; C08L79/08 ; H01L23/29 ; H01L23/373 ; C08G73/10
Abstract:
Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.
Public/Granted literature
- US20140005318A1 EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME Public/Granted day:2014-01-02
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