The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements.