Invention Grant
- Patent Title: Wiring member and semiconductor module having the same
- Patent Title (中): 具有相同的接线构件和半导体模块
-
Application No.: US13895903Application Date: 2013-05-16
-
Publication No.: US09123711B2Publication Date: 2015-09-01
- Inventor: Toshihiro Fujita , Hiroyasu Kidokoro , Hiromasa Hayashi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2012-113411 20120517
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00
Abstract:
A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.
Public/Granted literature
- US20130307129A1 WIRING MEMBER AND SEMICONDUCTOR MODULE HAVING THE SAME Public/Granted day:2013-11-21
Information query
IPC分类:
