Invention Grant
- Patent Title: Shielded package having shield lid
- Patent Title (中): 屏蔽包装有屏蔽盖
-
Application No.: US14021604Application Date: 2013-09-09
-
Publication No.: US09123718B1Publication Date: 2015-09-01
- Inventor: Donald Craig Foster
- Applicant: Amkor Technology, Inc.
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Agency: McAndrew, Held & Malloy, Ltd.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/52
Abstract:
A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.
Information query
IPC分类:
