Invention Grant
- Patent Title: Die warpage control for thin die assembly
- Patent Title (中): 用于薄模组件的模翘曲控制
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Application No.: US13631612Application Date: 2012-09-28
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Publication No.: US09123732B2Publication Date: 2015-09-01
- Inventor: Sandeep B. Sane , Shankar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
- Applicant: Sandeep B. Sane , Shankar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
Public/Granted literature
- US20140091470A1 DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY Public/Granted day:2014-04-03
Information query
IPC分类:
