Invention Grant
US09123734B2 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
有权
半导体封装用粘合剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置
- Patent Title: Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
- Patent Title (中): 半导体封装用粘合剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置
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Application No.: US14168628Application Date: 2014-01-30
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Publication No.: US09123734B2Publication Date: 2015-09-01
- Inventor: Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; C09J163/04 ; C09J179/08 ; H01L23/29 ; H01L23/00 ; C08G59/42 ; C09J163/00
Abstract:
The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.
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