Invention Grant
- Patent Title: Transmission line via structure
- Patent Title (中): 传输线通过结构
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Application No.: US14280223Application Date: 2014-05-16
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Publication No.: US09123738B1Publication Date: 2015-09-01
- Inventor: David M. Mahoney , Mohsen H. Mardi
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Robert Brush
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/44 ; H01L23/66 ; H01L21/768
Abstract:
In a transmission line via structure, a plurality of sub-structures are stacked in a via through the substrate along a longitudinal axis thereof. Each of the sub-structures includes a center conductor portion, an outer conductor portion, and at least one dielectric support member. The center conductor portion extends along the longitudinal axis. The outer conductor portion is disposed around the center conductor portion. The dielectric support member(s) separate the outer conductor portion and the center conductor portion and provide a non-solid volume between the outer conductor portion and the center conductor portion. Conductive paste is disposed between the center and outer conductor portions of successive ones of the plurality of sub-structures to form an outer conductor and a center conductor.
Information query
IPC分类:
