Invention Grant
- Patent Title: Method of manufacturing a component comprising cutting a carrier
- Patent Title (中): 制造包括切割载体的部件的方法
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Application No.: US13594711Application Date: 2012-08-24
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Publication No.: US09123764B2Publication Date: 2015-09-01
- Inventor: Thomas Behrens , Joachim Mahler , Ivan Nikitin
- Applicant: Thomas Behrens , Joachim Mahler , Ivan Nikitin
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/683 ; H01L21/78 ; H01L23/00 ; H01L21/67
Abstract:
A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.
Public/Granted literature
- US20140057396A1 Method of Manufacturing a Component Comprising Cutting a Carrier Public/Granted day:2014-02-27
Information query
IPC分类:
