Invention Grant
- Patent Title: Semiconductor device and method
- Patent Title (中): 半导体器件及方法
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Application No.: US14151193Application Date: 2014-01-09
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Publication No.: US09123791B2Publication Date: 2015-09-01
- Inventor: Gilberto Curatola
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L31/072
- IPC: H01L31/072 ; H01L29/778 ; H01L29/66

Abstract:
A semiconductor device includes a first compound semiconductor material including a first doping concentration and a second compound semiconductor material on the first compound semiconductor material, the second compound semiconductor material including a different material than the first compound semiconductor material. The semiconductor device further includes a control electrode and at least one buried semiconductor material region including a second doping concentration different from the first doping concentration. The at least one buried semiconductor material region is disposed in the first compound semiconductor material in a region other than a region of the first compound semiconductor material being covered by the control electrode.
Public/Granted literature
- US20150194513A1 Semiconductor Device and Method Public/Granted day:2015-07-09
Information query
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