Invention Grant
- Patent Title: Dicing die bond film
- Patent Title (中): 切割模具贴膜
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Application No.: US14072684Application Date: 2013-11-05
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Publication No.: US09123794B2Publication Date: 2015-09-01
- Inventor: Yasuhiro Amano , Miki Morita , Yuta Kimura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson and Bear, LLP
- Priority: JP2010-204487 20100913
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/78 ; C09J7/02 ; C09J9/02 ; H01L21/67 ; H01L23/00 ; H01L21/683 ; C08K7/00 ; H01L23/31 ; H01L25/065
Abstract:
The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10−6 Ω·cm or more and 1×10−3 Ω·cm or less, and the tensile storage modulus of the thermosetting type die bond film at −20° C. before thermal curing is 0.1 to 10 GPa.
Public/Granted literature
- US20140057100A1 DICING DIE BOND FILM Public/Granted day:2014-02-27
Information query
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