Invention Grant
- Patent Title: Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
- Patent Title (中): 半导体器件,集成电路及制造半导体器件的方法
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Application No.: US14027570Application Date: 2013-09-16
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Publication No.: US09123801B2Publication Date: 2015-09-01
- Inventor: Andreas Meiser , Till Schloesser , Thorsten Meyer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a transistor in a semiconductor substrate having a first main surface. The transistor includes a source region, a drain region, a channel region, a drift zone, and a gate electrode adjacent to at least two sides of the channel region. The channel region and the drift zone are disposed along a first direction parallel to the first main surface, between the source region and the drain region. The semiconductor device further includes a conductive layer beneath the gate electrode and insulated from the gate electrode.
Public/Granted literature
- US20150076590A1 Semiconductor Device, Integrated Circuit and Method of Manufacturing a Semiconductor Device Public/Granted day:2015-03-19
Information query
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