Invention Grant
- Patent Title: Method to manufacture short channel trench MOSFET
- Patent Title (中): 制造短通道沟槽MOSFET的方法
-
Application No.: US14080164Application Date: 2013-11-14
-
Publication No.: US09123805B2Publication Date: 2015-09-01
- Inventor: Sik Lui
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/78 ; H01L29/66

Abstract:
Aspects of the present disclosure describe a trench MOSFET with a channel length that may be controlled by counterdoping the body-drain junction to form a straggle region adjacent to the trenches. The channel length is defined between the straggle region at the bottom and a source region at the top. Both of the straggle region and the source region are of the same conductivity type though they may be different ion species.
Public/Granted literature
- US20150129956A1 METHOD TO MANUFACTURE SHORT CHANNEL TRENCH MOSFET Public/Granted day:2015-05-14
Information query
IPC分类: