Invention Grant
US09123821B2 Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode
有权
用于氧化物半导体的电极,其形成方法和设置有电极的氧化物半导体器件
- Patent Title: Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode
- Patent Title (中): 用于氧化物半导体的电极,其形成方法和设置有电极的氧化物半导体器件
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Application No.: US14018625Application Date: 2013-09-05
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Publication No.: US09123821B2Publication Date: 2015-09-01
- Inventor: Junichi Koike , Mayumi Naito , Pilsang Yun , Hideaki Kawakami
- Applicant: Advanced Interconnect Materials, LLC
- Applicant Address: JP Miyagi
- Assignee: Advanced Interconnect Materials, LLC
- Current Assignee: Advanced Interconnect Materials, LLC
- Current Assignee Address: JP Miyagi
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-066676 20110308
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/786 ; H01L29/66 ; H01L29/45 ; H01L33/40 ; H01L33/42

Abstract:
To make it possible to form a metal electrode of low electrical contact resistance on a conductive indium-containing oxide semiconductor layer constituting a device active layer of a thin-film transistor or the like. Between an indium-containing oxide semiconductor layer and a metal electrode layer provided above this layer for passing device operating current, which can reduce indium oxide or the like of the oxide semiconductor layer. A metallic oxide layer and a metal layer are formed using as material a metal film including an easily oxidable metal, and further an indium-rich layer in which reduced indium is accumulated is formed at a boundary between the metallic oxide layer and the metal layer.
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