Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14492965Application Date: 2014-09-22
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Publication No.: US09123843B2Publication Date: 2015-09-01
- Inventor: Takashi Kyono , Katsushi Akita , Kaoru Shibata , Koji Nishizuka , Kei Fujii
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Trent B. Ostler
- Priority: JP2013-222164 20131025
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0352 ; H01L31/0304 ; H01L31/09

Abstract:
A semiconductor device includes a semiconductor layer laminate in which a plurality of semiconductor layers are laminated, the semiconductor layer laminate including a light receiving layer, the light receiving layer being grown by a metal-organic vapor phase epitaxy method, the light receiving layer having a cutoff wavelength of more than or equal to 3 μm and less than or equal to 8 μm, the semiconductor device having a dark current density of less than or equal to 1×10−1 A/cm2 when a reverse bias voltage of 60 mV is applied at a temperature of −140° C. Thereby, a semiconductor device which can receive light in a mid-infrared range and has a low dark current is provided.
Public/Granted literature
- US20150115222A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-04-30
Information query
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