Invention Grant
- Patent Title: Light emitting element and illumination device thereof
- Patent Title (中): 发光元件及其照明装置
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Application No.: US13904038Application Date: 2013-05-29
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Publication No.: US09123868B2Publication Date: 2015-09-01
- Inventor: Shyi-Ming Pan , Wei-Kang Cheng , Chih-Shu Huang , Chen-Hong Lee , Shih-Yu Yeh , Chi-Chih Pu , Cheng-Kuang Yang , Shih-Chieh Tang , Siang-Fu Hong , Tzu-Hsiang Wang
- Applicant: Formosa Epitaxy Incorporation
- Applicant Address: TW Lung-Tan IND. Park, Lung-Tan, Tao-Yuan Hsien
- Assignee: Formosa Epitaxy Incorporation
- Current Assignee: Formosa Epitaxy Incorporation
- Current Assignee Address: TW Lung-Tan IND. Park, Lung-Tan, Tao-Yuan Hsien
- Agent Winston Hsu; Scott Margo
- Priority: TW101119098A 20120529; TW101121921A 20120619; TW101125599A 20120716; TW101131198A 20120828; TW101131643A 20120830; TW101132185A 20120904; TW101132187A 20120904; TW102116429A 20130508; TW102116650A 20130510
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L33/48 ; H01L25/075 ; H01L27/15 ; F21V21/002 ; H01L33/08 ; F21K99/00 ; H01L33/00 ; H01L33/20 ; H01L33/50 ; H01L33/62 ; F21Y111/00

Abstract:
A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base.
Public/Granted literature
- US20130322081A1 LIGHT EMITTING ELEMENT AND ILLUMINATION DEVICE THEREOF Public/Granted day:2013-12-05
Information query
IPC分类: