Invention Grant
- Patent Title: Electronic device and electronic apparatus
- Patent Title (中): 电子设备和电子设备
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Application No.: US13864470Application Date: 2013-04-17
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Publication No.: US09123881B2Publication Date: 2015-09-01
- Inventor: Kenji Sato , Norifumi Shimizu
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-096954 20120420
- Main IPC: H01L41/047
- IPC: H01L41/047 ; G01C19/5783 ; G01C19/5628
Abstract:
A sensor device includes an IC chip, a package which includes a base in which the IC chip is provided and houses the IC chip, the base having a through hole provided in a position that overlaps with the IC chip in the plan view, and a spacer which is provided between the IC chip and the base, and has an aperture communicating the through hole with the space on the opposite side to the base with respect to the IC chip in the package between the IC chip and the space.
Public/Granted literature
- US20130279136A1 ELECTRONIC DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2013-10-24
Information query
IPC分类:
