Invention Grant
US09123890B2 Resistance-switching memory cell with multiple raised structures in a bottom electrode
有权
在底部电极中具有多个凸起结构的电阻切换存储单元
- Patent Title: Resistance-switching memory cell with multiple raised structures in a bottom electrode
- Patent Title (中): 在底部电极中具有多个凸起结构的电阻切换存储单元
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Application No.: US13767663Application Date: 2013-02-14
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Publication No.: US09123890B2Publication Date: 2015-09-01
- Inventor: George Matamis , James K Kai , Vinod R Purayath , Yuan Zhang , Henry Chien
- Applicant: SanDisk 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L45/00 ; H01L27/24

Abstract:
A reversible resistance-switching memory cell has multiple narrow, spaced apart bottom electrode structures. The raised structures can be formed by coating a bottom electrode layer with nano-particles and etching the bottom electrode layer. The raised structures can be independent or joined to one another at a bottom of the bottom electrode layer. A resistance-switching material is provided between and above the bottom electrode structure, followed by a top electrode layer. Or, insulation is provided between and above the bottom electrode structures, and the resistance-switching material and top electrode layer are above the insulation. Less than one-third of a cross-sectional area of each resistance-switching memory cell is consumed by the one or more raised structures. When the resistance state of the memory cell is switched, there is a smaller area in the bottom electrode for a current path, so the switching resistance is higher and the switching current is lower.
Public/Granted literature
- US20140225057A1 Resistance-Switching Memory Cell With Multiple Electrodes Public/Granted day:2014-08-14
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