Invention Grant
- Patent Title: Cable assembly, electronic circuit module, and imaging apparatus
- Patent Title (中): 电缆组件，电子电路模块和成像设备
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Application No.: US12859987Application Date: 2010-08-20
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Publication No.: US09124026B2Publication Date: 2015-09-01
- Inventor: Mikio Nakamura , Hiroshi Suzushima , Fukashi Yoshizawa , Hideharu Miyahara
- Applicant: Mikio Nakamura , Hiroshi Suzushima , Fukashi Yoshizawa , Hideharu Miyahara
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JP2009-190835 20090820
- Main IPC: H01R13/6593
- IPC: H01R13/6593 ; H01R12/62 ; A61B1/00 ; H01R9/05 ; H01R13/02
Abstract:
A cable assembly includes a plurality of cables; and a cable fixing member which has a facing surface to be oppositely arranged, in connecting each of the cables to a member as a connection target, with respect to a connection surface of the connection target member and fixes a distal end part of each of the cables in a state where an axial direction of the distal end part of each of the cables is arranged along the facing surface, wherein a side surface of a core wire of each of the cables is exposed at a predetermined first position on the facing surface of the cable fixing member and a first connection part which connects the core wire of each of the cables to the connection target member is formed at the first exposed part.
Public/Granted literature
- US20110042140A1 CABLE ASSEMBLY, ELECTRONIC CIRCUIT MODULE, AND IMAGING APPARATUS Public/Granted day:2011-02-24
Information query
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