Invention Grant
- Patent Title: High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
- Patent Title (中): 高速输入/输出连接接口元件，电缆组件和互连系统，减少串扰
-
Application No.: US14063646Application Date: 2013-10-25
-
Publication No.: US09124037B2Publication Date: 2015-09-01
- Inventor: Rutger Smink , Lieven Decrock
- Applicant: Tyco Electronics Belgium EC BVBA , Tyco Electronics Nederland BV
- Applicant Address: NL S-Hertogenbosch BE Oostkamp
- Assignee: TE Connectivity Nederland BV,Tyco Electronics Belgium EC BVBA
- Current Assignee: TE Connectivity Nederland BV,Tyco Electronics Belgium EC BVBA
- Current Assignee Address: NL S-Hertogenbosch BE Oostkamp
- Agent Barley Snyder
- Main IPC: H01R13/6461
- IPC: H01R13/6461 ; H01R13/6466 ; H01R9/03 ; H01R12/62 ; H01R13/6585 ; H01R24/64 ; H01R107/00 ; H05K1/02 ; H05K1/11 ; H05K3/34
Abstract:
A high speed input/output plug assembly is disclosed having a plug body. A plurality of conductive traces are disposed on a surface of the plug body and connectable to an input/output cable. An electrically conductive grounding layer is positioned within the plug body and electrically insulated from the conductive traces, and has an opening extending through the grounding layer and below the conductive traces.
Public/Granted literature
Information query
