Invention Grant
- Patent Title: Electronic device with heat sink structure
- Patent Title (中): 具有散热器结构的电子设备
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Application No.: US13746135Application Date: 2013-01-21
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Publication No.: US09125300B2Publication Date: 2015-09-01
- Inventor: Chun-Fei Yang
- Applicant: WISTRON CORP.
- Applicant Address: TW New Taipei
- Assignee: Wistron Corp.
- Current Assignee: Wistron Corp.
- Current Assignee Address: TW New Taipei
- Priority: TW101115082A 20120427
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K1/02 ; F28F3/02
Abstract:
An electronic device includes a housing and a chip. The housing includes a main body and a supporting portion. The main body has an inner surface and an outer surface, and an opening disposed on the outer surface. The supporting portion is disposed on the inner surface, and has a heat dissipating chamber that communicates with the opening. The chip is disposed on the supporting portion, and the heat generated by the chip is transmitted via the housing.
Public/Granted literature
- US20130286589A1 ELECTRONIC DEVICE WITH HEAT SINK STRUCTURE Public/Granted day:2013-10-31
Information query
