A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.