Invention Grant
- Patent Title: Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board
- Patent Title (中): 柔性金属包覆基材，柔性金属包覆基材的制造方法，印刷电路板，多层柔性印刷电路板和柔性刚性印刷电路板
-
Application No.: US14359843Application Date: 2012-11-22
-
Publication No.: US09125307B2Publication Date: 2015-09-01
- Inventor: Takayoshi Ozeki , Hiroaki Umehara , Yoshiaki Esaki
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-254535 20111122; JP2012-172091 20120802
- International Application: PCT/JP2012/080287 WO 20121122
- International Announcement: WO2013/077397 WO 20130530
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; B32B15/088 ; C08G73/14 ; C08G73/12 ; C08L79/08 ; H05K3/02 ; H05K3/46 ; C08G73/10 ; H05K3/38 ; H05K1/03
Abstract:
The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a polyamide-imide resin. The polyamide-imide resin includes a first constituent unit represented by Formula (1) and a second constituent unit represented by Formula (2). The percentage of the second constituent unit is in a range of 5 to 35% by mol.
Public/Granted literature
Information query
