Invention Grant
US09125309B2 Epoxy resin, curable resin composition and cured product thereof, and printed wiring board
有权
环氧树脂，固化性树脂组合物及其固化物，印刷线路板
- Patent Title: Epoxy resin, curable resin composition and cured product thereof, and printed wiring board
- Patent Title (中): 环氧树脂，固化性树脂组合物及其固化物，印刷线路板
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Application No.: US14343924Application Date: 2012-07-11
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Publication No.: US09125309B2Publication Date: 2015-09-01
- Inventor: Yutaka Satou
- Applicant: Yutaka Satou
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV
- Priority: JP2011-205956 20110921
- International Application: PCT/JP2012/067699 WO 20120711
- International Announcement: WO2013/042438 WO 20130328
- Main IPC: B32B27/38
- IPC: B32B27/38 ; C08G59/50 ; C08L61/02 ; H05K1/03 ; C08G59/32 ; C08G59/02 ; H05K3/00
Abstract:
Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.
Public/Granted literature
- US20140287241A1 EPOXY RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD Public/Granted day:2014-09-25
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