Invention Grant
- Patent Title: Electrostatic dissipative composites
- Patent Title (中): 静电消散复合材料
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Application No.: US13328468Application Date: 2011-12-16
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Publication No.: US09125310B2Publication Date: 2015-09-01
- Inventor: Mohammad Moniruzzaman
- Applicant: Mohammad Moniruzzaman
- Applicant Address: NL Bergen op Zoom
- Assignee: SABIC Global Technologies B.V.
- Current Assignee: SABIC Global Technologies B.V.
- Current Assignee Address: NL Bergen op Zoom
- Agency: Baker & Hostetler LLP
- Main IPC: H01B1/06
- IPC: H01B1/06 ; H05K1/03 ; H01B1/24 ; H01L23/29 ; H05K9/00 ; H05K1/02

Abstract:
The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.
Public/Granted literature
- US20130153832A1 ELECTROSTATIC DISSIPATIVE COMPOSITES Public/Granted day:2013-06-20
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