Invention Grant
- Patent Title: Hollow sealing structure
- Patent Title (中): 中空密封结构
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Application No.: US14232591Application Date: 2012-09-21
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Publication No.: US09125311B2Publication Date: 2015-09-01
- Inventor: Takashi Ueda , Masamoto Tago
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-208642 20110926
- International Application: PCT/JP2012/074184 WO 20120921
- International Announcement: WO2013/047354 WO 20130404
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H01L23/10 ; H01L23/08 ; H01L23/043
Abstract:
A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate. The resin layer is connected to the positioning part and the fixation part.
Public/Granted literature
- US20140166352A1 HOLLOW SEALING STRUCTURE Public/Granted day:2014-06-19
Information query
