Invention Grant
- Patent Title: Conductive film and method for its production
- Patent Title (中): 导电膜及其生产方法
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Application No.: US13574073Application Date: 2011-01-18
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Publication No.: US09125315B2Publication Date: 2015-09-01
- Inventor: Ko Higashitani , Yasuhiro Tsudo , Masaki Nakayama , Shinji Kake
- Applicant: Ko Higashitani , Yasuhiro Tsudo , Masaki Nakayama , Shinji Kake
- Applicant Address: JP Kyoto-shi JP Kyoto-shi JP Tokyo
- Assignee: Kyoto University,SANYO CHEMICAL INDUSTRIES, LTD.,Mitsubishi Rayon Co., Ltd.
- Current Assignee: Kyoto University,SANYO CHEMICAL INDUSTRIES, LTD.,Mitsubishi Rayon Co., Ltd.
- Current Assignee Address: JP Kyoto-shi JP Kyoto-shi JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-008998 20100119; JP2010-169535 20100728
- International Application: PCT/JP2011/050774 WO 20110118
- International Announcement: WO2011/090034 WO 20110728
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/12 ; H05K9/00 ; H01B1/02

Abstract:
To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production.A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
Public/Granted literature
- US20120325545A1 CONDUCTIVE FILM AND METHOD FOR ITS PRODUCTION Public/Granted day:2012-12-27
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