Invention Grant
- Patent Title: Package
- Patent Title (中): 包
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Application No.: US13882217Application Date: 2010-11-09
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Publication No.: US09125321B2Publication Date: 2015-09-01
- Inventor: Yoshiyuki Kusano , Mutsumi Shimazaki
- Applicant: Yoshiyuki Kusano , Mutsumi Shimazaki
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- International Application: PCT/JP2010/069925 WO 20101109
- International Announcement: WO2012/063321 WO 20120518
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; B81B7/00 ; H01L23/31 ; H01L23/495 ; H01R13/11 ; H01R13/405 ; H01L23/00

Abstract:
A package includes a main unit having formed therein a through hole that penetrates the package from a first surface to a second surface; and a connection terminal that is provided inside the through hole. The second surface is a bottom surface of the main unit, and has an electric circuit incorporated therein. The connection terminal is electrically connected to the electric circuit incorporated in the main unit, and configured to be contactable by an insertion target that is inserted in the through hole from a side of an inserting direction.
Public/Granted literature
- US20130215585A1 PACKAGE Public/Granted day:2013-08-22
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