The present disclosure relates to a conductive connection structure, and more particularly to a pin structure and pin connection structure thereof. The pin structure is disposed at least one side of an anisotropic conductive film. A plurality of conductive particles is distributed over the interior of the anisotropic conductive film. The pin structure comprises: a plurality of columns which are interspaced, wherein, the conductive particles are in the periphery of the columns. The pin structure and pin connection structure provided by the present disclosure use a pin structure comprising a plurality of columns which are interspaced. When the anisotropic conductive film is used to laminate pin structures, spacing between adjacent columns can contain the conductive particles so as to reduce the number of conductive particle that flow between the left-and-right adjacent pin structures, thereby reducing incidence of short circuit of the left-and-right adjacent pin structures.