An insole can include: an upper conductive ground plane layer; an upper compressible insulating layer physically coupled to the upper conductive ground plane layer; a conductive sensor layer physically coupled to the upper compressible insulating layer, the conductive sensor layer comprising one or more sensors are configured to a force applied to the insole by the foot; a lower compressible insulating layer physically coupled to conductive sensor layer; a lower conductive ground plane layer physically coupled to the lower compressible insulating layer and electrically coupled to the upper conductive ground plane layer; and at least one computational unit communicatively coupled to the one or more sensors. The upper conductive ground plane layer and the lower conductive ground plane layer are configured to substantially electrically shield the upper compressible insulating layer, the conductive sensor layer, and the lower compressible insulating layer from the shoe and the foot. Other embodiments are disclosed.