Invention Grant
- Patent Title: Medical electrical lead with conductive sleeve head
- Patent Title (中): 医用电导线带导电套头
-
Application No.: US13097187Application Date: 2011-04-29
-
Publication No.: US09126031B2Publication Date: 2015-09-08
- Inventor: Mohac Tekmen , Kevin R. Seifert
- Applicant: Mohac Tekmen , Kevin R. Seifert
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Michael J. Ostrom
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/05 ; A61N1/08

Abstract:
This disclosure provides a medical lead assembly that includes a lead body having a proximal end configured to couple to an implantable medical device and a distal end. The lead assembly further includes an electrode assembly located at the distal end of the lead body, the electrode assembly including a tip electrode, a conductive electrode shaft that is electrically coupled to the tip electrode and an energy dissipating structure that is coupled to at least a portion of the conductive electrode shaft at high frequencies to redirect at least a portion of the current induced in the lead by a high frequency signal from the tip electrode to the energy dissipating structure.
Public/Granted literature
- US20110270369A1 MEDICAL ELECTRICAL LEAD WITH CONDUCTIVE SLEEVE HEAD Public/Granted day:2011-11-03
Information query