Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US14298027Application Date: 2014-06-06
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Publication No.: US09126144B2Publication Date: 2015-09-08
- Inventor: Tomokatsu Aoyama
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-123243 20130611
- Main IPC: B01D46/24
- IPC: B01D46/24 ; C04B38/00 ; B01D53/74

Abstract:
There is disclosed a honeycomb structure in which a ring crack is not easily generated. A honeycomb structure includes a honeycomb substrate, and a bulging portion continuously or intermittently surrounding, in a ring shape, at least a part of an outer periphery of the honeycomb substrate. The outer periphery of the honeycomb substrate has one or a plurality of stress relaxing portions which are crevices each having an open end in the surface over a region of −5 to +10 mm or less from a reference bonded portion to a tapered surface, and a total of lengths of all the stress relaxing portions is 3% or more of a circumferential length of the honeycomb substrate.
Public/Granted literature
- US20140363616A1 HONEYCOMB STRUCTURE Public/Granted day:2014-12-11
Information query
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