Invention Grant
- Patent Title: Dispensing module and method for dispensing an adhesive
- Patent Title (中): 分配模块和分配粘合剂的方法
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Application No.: US14068936Application Date: 2013-10-31
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Publication No.: US09126223B2Publication Date: 2015-09-08
- Inventor: Leonard J. Lanier
- Applicant: Nordson Corporation
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans, LLP
- Main IPC: B67D3/00
- IPC: B67D3/00 ; B05C5/02 ; B05B15/02 ; B05B1/30

Abstract:
A dispensing module and method of dispensing an adhesive includes a dispenser body assembly having a liquid supply passage, a nozzle member having a liquid passageway, a valve element, and a valve seat. The liquid passageway includes a discharge passageway defining an outlet, a first converging surface, a bore, and a shoulder positioned between the first converging surface and the bore. The valve element extends along an axis within the liquid passageway and has a bulbous end portion movable along the axis between an open position and a closed position. The bulbous end portion has a valve needle smaller than the bore to inhibit obstruction to the discharge passageway for adhesive flowing thereto. The valve seat seals against the bulbous end portion in the closed position such that a region of the valve needle projects into the discharge passageway for inhibiting clogging of the adhesive proximate to the outlet.
Public/Granted literature
- US20150114999A1 DISPENSING MODULE AND METHOD FOR DISPENSING AN ADHESIVE Public/Granted day:2015-04-30
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