Invention Grant
- Patent Title: Method of processing a substrate
- Patent Title (中): 处理基板的方法
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Application No.: US14247282Application Date: 2014-04-08
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Publication No.: US09126260B2Publication Date: 2015-09-08
- Inventor: Joerg Ortner , Michael Sorger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: B22D19/00
- IPC: B22D19/00 ; H01L21/02 ; H01L21/768 ; H01L21/311 ; H01L21/48 ; H01L23/00 ; G03F7/00 ; B82Y10/00 ; B82Y40/00
Abstract:
In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench.
Public/Granted literature
- US20140220257A1 METHOD OF PROCESSING A SUBSTRATE Public/Granted day:2014-08-07
Information query
